Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

Modell nr.
702-0000857

Character
Environmental Protection

Production Process
CNC

Interface Type
SD Interface

Stämpla
Sireda

Pin Count
162

Pitch
0.5mm

Kontakt
Spring Probe

Paket
BGA

IC Size
11.5X13mm

Transportpaket
Kartong

Specifikation
BGA162

Varumärke
Sireda

Ursprung
Shenzhen, Kina

HS-kod
8536690000

Produktionskapacitet
2000PCS/Månad

Beskrivning

Produktbeskrivning
eMCP BGA162 Test socket

1. Applicable for eMMC,eMCP devices from Samsung, Hynix, Sandisk, Toshiba, Kingston, Intel,etc, including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529.

2. Support for eMMC version 5.0 or above.

3. Chip-off IC devices failure analysis, real time write-and-read in forensic application.

4. Support for hot plug, eMMC/eMCP can be directly connected to PC with SD port.

Produktparametrar
Mechanical
Material Socket Body Torlon/PPS
Material Socket Lid AL, POM
Kontakt Pogo Pin
Operation Temperature -0 ~ 80 ºC
Life Span 50K Cycles
Spring Force 20g ~ 30g per Pin
Electrical
Current Rating 2.59A
DC Resistance 42mΩ@0.65mm

Specifikation
eMCP BGA162(702-0000857)

IC Size: 11.5X13mm
Solder Ball: with solder ball
Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

Relative Products

Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.

Part Number Beskrivning IC Chip Type
702-0000857 BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 BA With solder ball
702-0000859 BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 NB Without solder ball
702-0000873 BGA162 0.5mm eMCP CS125 12×13.5mm SD B0 BA With solder ball
702-0000875 BGA162 0.5mm eMCP CS125 12×13.5mm SD B0 NB Without solder ball
702-0000865 BGA186 0.5mm eMCP CS125 12x16mm SD B0 BA With solder ball
702-0000867 BGA186 0.5mm eMCP CS125 12x16mm SD B0 NB Without solder ball
702-0000899 BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 BA With solder ball
702-0001037 BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 NB Without solder ball
702-0001028 BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA With solder ball
702-0001040 BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB Without solder ball
702-0000976 BGA100 1.0mm eMMC CS125 14x18mm SD B0 BA With solder ball
702-0001035 BGA100 1.0mm eMMC CS125 14x18mm SD B0 NB Without solder ball
702-0001315 BGA136 0.5mm eMMC CS125 10x10mm SD B0 NB Without solder ball
702-0001326 BGA136 0.5mm eMMC CS125 10x10mm SD B0 BA With solder ball
702-0000828 BGA529 0.5mm eMCP CS125 15x15mm SD B0 BA With solder ball
702-0000830 BGA529 0.5mm eMCP CS125 15x15mm SD B0 NB Without solder ball
702-0001028 BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA With solder ball
702-0001040 BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB Without solder ball
702-0001586 BGA254 0.5mm eMCP CS125 12x15mm SD B0 NB Without solder ball
702-0001587 BGA280 0.45mm eMCP CS125 14×14.5mm SD B0 NB Without solder ball
702-0001685 BGA153+162+221 0.5mm CS125 3 in1 SD B0 NB Without solder ball

företagsprofil

Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world’s leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.

Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.

Certifieringar

Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
Sireda has been authorized as National High Technology Expertise.

Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.

Sireda is highly recognized by industry professionals as a company with growth potential.

Våra fördelar
No MOQ No MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost Performance We provide products with high quality and competitive price.
Technical Support We have a professional R & D team and all the engineers have more than 5 år’ experience.
So we have the ability to design and produce best products according to our customersrequirements.
Best Service We provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.

Our Exhibition and Customers

Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm