Описание
| Technical Capabilities | |||
| Items | Speci. | Примечание | |
| Max panel size | 32″ x 20.5″(800mm x 520mm) | ||
| Максимум. Board size | 2000×610mm | ||
|
Мин.. board Thickness |
2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Мин.. line Width/Space | 0.1мм(4mil) | ||
| Максимум. Copper thickness | 10OZ | ||
| Мин.. S/M Pitch | 0.1мм(4mil) | ||
| Мин.. hole size | 0.2мм(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05мм(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6H | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300В | ||
| Мин.. blind/buried via | 0.15мм (6mil) | ||
| Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
| Materials | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13мм) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1мм) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 мм | ||
| Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 мм | ||
| Min finished hole | 0.1 мм | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 08:01 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material | ≤+1.2mil | ||
| Finished thickness | |||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5мм | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. |
||
| Max Nickel thickness for Gold finger | 280u”(7um) | ||
| Max gold thickness for Gold finger | 30u”(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u”/240u”(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u”/6u”(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
1.2m long Aluminum Based PCB with LF HASL
1. 1.2-1.5m extra Long Aluminium PCB use in big studio and Gymnasium show lighting.
2.PCB Certificate:ISO UL REACH and RoHS
3. Материал:Aluminum
4.Best price with excellent after-service, 24 hours online service
All kinds of high quality OEM PCB with fast delivery time and competitive price is always our service.
Welcome to contact us for more details and talk further business.
Inquiries are typically answered within 24 часы .
Wish you all the best and prosperous business.
the follow Picture is our Factory Drill Room sight 🙂
| NO | ITEM | MCPCB Technical capabilities |
| 1 | Layers | 1-3 layers |
| 2 | Максимум. Board size | 2000×610mm |
| 3 | Мин.. board Thickness | 1-layer 0.8mm |
| 2-layer 1.6mm | ||
| 3- layer 1.8mm | ||
| 4 | Мин.. line Width/Space | 0.2мм |
| 5 | Максимум. Copper thickness | 3 OZ |
| 6 | Мин.. S/M Pitch | 0.15мм |
| 7 | Мин.. hole size | 0.6мм |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05мм |
| 10 | Hole position deviation | ±0.05mm |
| 11 | Outline tolerance | ±0.10mm |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 ΩNormal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6H |
| 16 | Thermal stress | 288°C 20Sec |
| 17 | Test Voltage | 50-300В |
| 18 | Мин.. blind/buried via | 0.2 мм |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |