Descrição
Key Specifications/Special Features:
Deliverables
1/Quotes in 24 hours or less
2/Standard production leadtime of 20 dias úteis (4 weeks)
3/Prototype leadtime of 5 para 10 dias úteis (1-2 weeks)
4/Stack-ups and impedance simulation in 36 horas
5/Initial response to technical questions or quality concerns in 36 horas
6/DFM and EQ’s prior to PO placement upon request
Quality system
1/ mature and stringent Quality policy
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
| Technical Capability of rigid-flex PCB | ||||||||||||
| Item | Produção em massa | Small batch | ||||||||||
| Max Layer count | 16 | 20 | ||||||||||
| Structural style(Rigid layers count/Flex layers count) | 16L/8L | |||||||||||
| Min/Max board size(milímetros) | 15*10/560*406 | 15*10/560*406 | ||||||||||
| Finished Thickness(milímetros) | 0.35-3.0 | 0.3-3.2 | ||||||||||
| Finished Thickness tolerance | ±10%(>1.0milímetros)/±0.1mm(≤1.0milímetros) | ±10%(>1.0milímetros)/±0.1mm(≤1.0milímetros) | ||||||||||
| Flex core dielectric type | PI | PI | ||||||||||
| Rigid material type | High Tg/Middle Tg/Common Tg FR4 | High Tg/Middle Tg/Common Tg FR4; PI;High frequency,High speed | ||||||||||
| Cover film thickness(um) | 28/50/60/80 | 28/50/60/80 | ||||||||||
| Adhesive thickness(um) | 25/40/50/65 | 25/40/50/65 | ||||||||||
| Min./Max.copper thickness (um) | 12/70 | 12/70 | ||||||||||
| Flex material dielectric thickness, Min./Max. (um) | 25~75 | 25~75 | ||||||||||
| Mechnical drill, Min. | 0.20milímetros | 0.20milímetros | ||||||||||
| Hole position tolerance | ±2mil | ±2mil | ||||||||||
| hole center to center, Min. | 0.5milímetros | 0.5milímetros | ||||||||||
| PTH Aspect ratio, Máx.. | 8:1 (through);0.8:1 (blind) | 12:1 (through);0.8:1 (blind) | ||||||||||
| Laser drill diameter | 4-6mil | 4-6mil | ||||||||||
| Min. track width/space(Hoz material) | 3.5mil/3.5mil | 3.5mil/3.5mil | ||||||||||
| Inner layer track width tolerance | ±10% | ±10% | ||||||||||
| Spilled glue amount of Rigid&flex joint max. | 1.0milímetros | 1.0milímetros | ||||||||||
| Graphic to edge of rigid&flex Min. | 20mil | 20mil | ||||||||||
| PTH wall to edge of joint of rigid&flex, Min. | 20mil | 20mil | ||||||||||
| PTH to track in inner layer(mil), Min. | 8 | 7 | ||||||||||
| Flex area length, Min. | 5milímetros | 4milímetros | ||||||||||
| Bending radius, Min. | 6*thickness | 3*thickness | ||||||||||
| Outline size tolerance | ±0.13mm | ±0.1mm | ||||||||||
| PAD size tolerance | ±20% | ±20% | ||||||||||
| Soldermask registration/min.soldermask bridge | 2mil/4mil | 2mil/4mil | ||||||||||
| Stiffener material | PI/FR4/Steel | PI/FR4/Steel | ||||||||||
| Stiffener registration/Spilled glue length | 8mil/3mil | 8mil/3mil | ||||||||||
| Cover film soldermask opening/Min.Cover film bridge | Φ0.5mm/0.3mm | Φ0.5mm/0.3mm | ||||||||||
| Cover film registration/Spilled glue length | 2mil | 2mil | ||||||||||
| Min BGA Pitch(milímetros) | 0.5 | 0.4 | ||||||||||
| Material brand of rigid | Shengyi,ITEQ,Rogers | |||||||||||
| Material brand of flex | Shengyi,taihong,dupont,panasonic | |||||||||||
Close work with Shengyi factory for the material. Welcome to send RFQ and visit our factory.
If your order structure is high mix and low volume, we are quite suitable for you. Welcome your RFQ.