Custom Single/Double/Multilayer 94V0 RoHS Printed Circuit Board PCBA Assembly PCB Board

Modelo NÃO.
01

Tecnologia de Processamento
Folha Eletrolítica

Base Material
Alumínio

Insulation Materials
Organic Resin

Marca
Oyk

Capacidade de produção
10000

Descrição

t’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
The tapy and specification of Aluminum based PCB CCAF-01, CCAF-04-UMA, And 0.8mm, 1.0milímetros, 1.5milímetros, 2.0milímetros, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.

It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
The tapy and specification of Aluminum based PCB CCAF-01, CCAF-04-UMA, And 0.8mm, 1.0milímetros, 1.5milímetros, 2.0milímetros, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.

Technique parameter:

Item
Test item
Technology request
Unidade
Test result
1
Peel Strength
UMA
≥ 1.0
N/mm
1.05
After thermal stress (260 ordm;C )
≥ 1.0
N/mm
1.05
2
Blister test AfterThermal stress (288 ordm;C, 2min)
288ordm;C 2 min
No delaminating

/
OK
3
Themal Resistance
≤ 2.0
ordm;C /W
0.65
4
Flammability(UMA)
FV-O
/
FV-O
5
Surface Resistivity
UMA
≥ 1 × 10 5
M Ω
5.0 × 10 7
Constant humidity treatment
(90%,3 5 ordm;C ,96h)

≥ 1 × 10 5
M Ω
4.5 × 10 6
6
7

Volume Resistivity
UMA
≥ 1 × 10 6
M Ω· m
1.0 × 10 8
Constant humidity treatment
(90%,3 5 ordm;C ,96h)

≥ 1 × 10 6
M Ω· m
1.9 × 10 7
8
Dielectric Breakdown (CC )
≥ 25
Kv/mm
31
9
Dielectric constant (1MHz)
(40 ordm;C, 93% , 96h)

≤ 4.4
/
4.2
10
Dielectric dissipation factor (1MHz )
(40ordm;C ,93%,96h)

≤ 0.03
/
0.029
Accelerated aging experiment
(125 ordm;C ,2000h)

The laminate bace should no wrinkles,no crack,no delaminating or no pine
/
OK
11
High low temperature impact test
(-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation)
Peel Strength
/
N/mm
1.39 ~ 1.64
Surface Resistivity
/
M Ω
1.9 × 10 8 ~6.4 × 10 8