Custom Open Top and Clamshell Test Socket, Burn in Socket for Semiconductor Devices Built with High-Performance Material

Modelo NÃO.
701-0000XXX

Package
BGA, LGA, Qfn, Qfp, Wlcsp, Sop etc

Contato
Spring Probe

Support IC Type
Emmc, Emcp, DDR, Nand, Ufs, DDR, DDR3, DDR4

Socket Type a
Open Top

Socket Type B
Clamshell

Emmc IC Chips
BGA153, BGA169, BGA136, BGA100

Emcp IC Chips
BGA162, BGA186, BGA221, BGA254, BGA280, BGA529

DDR Chips
BGA78, BGA96, BGA128, BGA190, BGA170, BGA84 etc

Nand Chips
LGA60, BGA152, etc

Custom
Acceptable

Pacote de transporte
Carton Box

Especificação
Burn in Socket

Marca comercial
Sireda

Origem
Shenzhen, China

Código HS
8536690000

Capacidade de produção
2000PCS/mês

Descrição

Burn-in Socket

Burn-in socket is designed for cost-effective burn in aging, debug and validation test application, our test socket are made
with high quality material and electrial contact capable of meeting HAST and HALT test requirements to reliable and accurate
test results.

Nome Photos
Clamshell Test Socket Custom Open Top and Clamshell Test Socket, Burn in Socket for Semiconductor Devices Built with High-Performance Material
Open Top Socket Custom Open Top and Clamshell Test Socket, Burn in Socket for Semiconductor Devices Built with High-Performance Material Custom Open Top and Clamshell Test Socket, Burn in Socket for Semiconductor Devices Built with High-Performance Material

>>> Product Specification
Burn-in Socket
Pacakge BGA, LGA, QFN
Nb of Pins 2~200
Pitch 0.35mm or above
Mecânico
Material Socket Body
Peek Ceramic/Torlon/PEI/PPS
Material Socket Lid
AL,POM
Contato
Pogo Pin
Operation Temperature
-40 ~ 140 C
Life Span
50K Cycles
Spring Force
20g ~ 30g per Pin
Elétrico
Current Rating
1.0A Min
DC Resistance
Máx.. 100mΩ
>>> Application Examples

Custom Open Top and Clamshell Test Socket, Burn in Socket for Semiconductor Devices Built with High-Performance MaterialCustom Open Top and Clamshell Test Socket, Burn in Socket for Semiconductor Devices Built with High-Performance Material

RELATIVE PRODUCTS


List of Some Burn-in Sockets

Part Number Package Descrição Socket Type
711-0000001 BGA153 BGA153 0.5mm eMMC OT101 11.5x13mm Open Top
711-0000002 BGA152 BGA152 1.0mm Nand OT102 14x18mm Open Top
711-0000004 BGA153 BGA153 0.5mm eMMC OT101 7.5×12.5milímetros Open Top
711-0000005 QFN8 QFN8 1.27mm OT101 6x8mm Open Top
711-0000006 BGA153 BGA153 0.5mm UFS OT101 11.5x13mm Open Top
701-0000041 BGA162 BGA162 0.5mm eMCP CS100 11.5x13mm Clamshell
701-0000048 BGA221 BGA221 0.5mm eMCP CS100 11.5x13mm Clamshell
701-0000049 BGA152 BGA152 1.0mm Nand CS100 14x18mm Clamshell
701-0000050 BGA153 BGA153 0.5mm eMMC CS100 11.5x13mm Clamshell
701-0000051 BGA132 BGA132 1.0mm Nand CS100 12x18mm Clamshell
701-0000063 MicroSD 8PIN 1.1mm MicroSD Card CS100 11x15mm Clamshell
701-0000065 BGA63 BGA63 0.8mm Nand CS100 9x11mm Clamshell
701-0000066 BGA136 BGA136 0.5mm eMCP CS100 10x10mm Clamshell
701-0000068 BGA153 BGA153 0.5mm UFS CS100 11.5x13mm DIP48 Clamshell
701-0000070 BGA153 BGA153 0.5mm eMMC CS100 11.5x13mm DIP48 Clamshell
701-0000071 TF card LGA8 1.475mm nMMC CS100 8.8×12.3milímetros Clamshell
701-0000077 BGA254 BGA254 0.5mm eMCP CS100 11.5x13mm Clamshell
701-0000099 LGA60 LGA60 1.0mm E2Nand CS100 12x17mm Clamshell
701-0000101 MicroSD 17PIN 0.76mm MicroSD Card CS100 11x15mm Clamshell
701-0000102 BGA162 BGA162 0.5mm ESMT nMCP CS100 8×10.5milímetros Clamshell
701-0000107 BGA130 BGA130 0.65mm DDR CS100 8.0×9.0milímetros Clamshell
701-0000120 BGA162 BGA162 0.5mm DDR2 CS100 8×10.5milímetros Clamshell
701-0000121 BGA254 BGA254 0.5mm uMCP CS100 11.5x13mm Clamshell
701-0000127 BGA153 BGA153 0.5mm eMMC CS100 9x10mm Clamshell
701-0000134 BGA153 BGA153 0.5mm eMMC CS100 9×7.5milímetros Clamshell
701-0000153 BGA153 BGA153 0.5mm eMMC CS100 7.5x9mm Clamshell
701-0000157 BGA153 BGA153 0.5mm eMMC CS100 11.5x13mm Clamshell
701-0000159 BGA168 BGA168 0.5mm eMCP 12x12mm Clamshell
701-0000163 BGA153 BGA153 0.5mm UFS CS100 11.5x13mm Clamshell
701-0000164 BGA100 BGA100 1.0mm CS100 14x18mm Clamshell
701-0000214 BGA320 BGA320 0.4mm CS100 12x13mm Clamshell
>>Not all sockets listed in this list, please contact us for more IC test sockets or customize a socket to fit your own application.
WHY CHOOSE US

As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also
get the certificate of ISO9001:2015 & National High-tech.

Emmc BGA169 BGA 169 Test Socket with Interposer and Removable Lid for Debug Validation of Semiconductor Devices

Be the world’s leading socket supplier

Creat value for our customer
To provide ground solutions that are well engineered, pramatic and innovative, using the specialist skills and experience for our team, to meet and excced the expectations of our clients.

Pursue details, profession,efficiency, responsibility
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.

Integrity, honesty and openness in everything we do
Recognising the vital importance of listening and valuing the opinion of others. Creating a fulfilling working enviroment where our people to realise their potential.

COMPANY PROFILE

Emmc BGA169 BGA 169 Test Socket with Interposer and Removable Lid for Debug Validation of Semiconductor Devices



Sireda Technology Co., Ltd was established in 2010. We specialize in the manufacture of semiconductor test socket and test fixtures for all kinds of semiconductor IC like CPU, Memory, Power Supply, MCU, RF, etc. We also provide BGA IC rework, reballing,or reball kit.

With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized design, shortest lead time, and most professional service.

As an IC testing socket supplier, we focus on Research and Innovations of Semiconductor Test with many Patents and ISO9001:2015 certificação. We try our best to understand customer demand, as we always take customers as our business partner from the very beginning.


OUR PARTNERS

Emmc BGA169 BGA 169 Test Socket with Interposer and Removable Lid for Debug Validation of Semiconductor Devices




CERTIFICATIONS

Emmc BGA169 BGA 169 Test Socket with Interposer and Removable Lid for Debug Validation of Semiconductor Devices



CONTACT US

Emmc BGA169 BGA 169 Test Socket with Interposer and Removable Lid for Debug Validation of Semiconductor Devices