2018 High Quality Aluminium Based Metal Core PCB

Modelo NÃO.
Aluminium PCB-4

Material
Alumínio

Board Thickness
0.8milímetros,1.0milímetros,1.2milímetros,1.6milímetros,2.0milímetros,2.2milímetros

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Ccl Brand
Jh,Ccaf.etc

Sample Date
3-5dias

Pacote de transporte
Vacuum Packing

Especificação
SGS UL ISO

Marca comercial
ZAPON

Origem
China

Código HS
85340090

Capacidade de produção
50.000sqm/Month

Descrição

Descrição do produto:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-UMA, CCAF-05etc. And 0.8mm, 1.0milímetros, 1.5milímetros, 2.0milímetros, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600milímetros (20″×, 24″); 600mm ×, 1060milímetros (24″×, 42″)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5milímetros
Technique parameter:

Test item Technology request Unidade Test result
1 Peel Strength UMA ≥ 1.8 N/mm 2
After thermal stress (260ordm;C) ≥ 1.8 N/mm 1.8
2 Blister test AfterThermal stress (260C, 2min ) No delaminating / Ok
3 Flammability(UMA) FV-O / FV-O
4 Thermal resistance ≤ 2.0 ordm;C /W 1
5 Surface Resistivity UMA ≥ 1 × 10 5 M Ω 5 × 10 7
Constant humidity treatment ≥ 1 × 10 5 M Ω 2 × 10 6
(90%,3 5 ordm;C,96h)
6 Volume Resistivity UMA ≥ 1 × 10 6 M Ω· m 4 × 10 8
Constant humidity treatment ≥ 1 × 10 6 M Ω· m 5 × 10 7
(90%,3 5ordm;C ,96h)
7 Dielectric Breakdown ( CC ) ≥ 28.5 Kv/mm 31
8 Dielectric constant (1MHz ) ≤ 4.4 / 4.2
(40 ordm;C,93% , 96h )
9 Dielectric dissipation factor (1MHz ) ≤ 0.03 / 0.02
(40 ordm;C, 93% ,96h )