1.6mm Aluminium PCB for Lighting Industry

Modelo NÃO.
Aluminium PCB-3

Board Thickness
0.8milímetros,1.0milímetros,1.2milímetros,1.6milímetros,2.0milímetros,2.2milímetros

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Ccl Brand
Jh,Ccaf.etc

Sample Date
3-5dias

Pacote de transporte
Vacuum Packing

Especificação
UL, TS16949, IPC 600 CLASS 2

Marca comercial
ZAPON

Origem
CHINA

Código HS
85340090

Capacidade de produção
50000sqm/Month

Descrição

Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.

It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.

Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-UMA, CCAF-05etc. And 0.8mm, 1.0milímetros, 1.5milímetros, 2.0milímetros, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm × , 600milímetros (20″× , 24″); 600mm × , 1060milímetros (24″× , 42″)

CCAF-04-A Aluminum-base copper-clad laminate
The test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 80um(matrial of the high heat dissipation)
Thickness of the aluminum-base: 1.5milímetros

The result of the test:

Test item Technology request Unidade Test result
1 Peel Strength UMA ≥ 1.0 N/mm 1.05
After thermal stress (260 ordm;C ) ≥ 1.0 N/mm 1.05
2 Blister test AfterThermal stress (288 ordm;C, 2min) 288ordm;C 2 min
No delaminating		 / OK
3 Themal Resistance ≤ 2.0 ordm;C /W 0.65
4 Flammability(UMA) FV-O / FV-O
5 Surface Resistivity UMA ≥ 1 × 10 5 M Ω 5.0 × 10 7
Constant humidity treatment
(90%,3 5 ordm;C ,96h)		 ≥ 1 × 10 5 M Ω 4.5 × 10 6
6
7		 Volume Resistivity UMA ≥ 1 × 10 6 M Ω@ m 1.0 × 10 8
Constant humidity treatment
(90%,3 5 ordm;C ,96h)		 ≥ 1 × 10 6 M Ω@ m 1.9 × 10 7
8 Dielectric Breakdown (CC ) ≥ 25 Kv/mm 31
9 Dielectric constant (1MHz)
(40 ordm;C, 93% , 96h)		 ≤ 4.4 / 4.2
10 Dielectric dissipation factor (1MHz )
(40ordm;C ,93%,96h)		 ≤ 0.03 / 0.029
Accelerated aging experiment
(125 ordm;C ,2000h)		 The laminate bace should no wrinkles,no crack,no delaminating or no pine / OK
11 High low temperature impact test
(-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation) 		Peel Strength / N/mm 1.39 ~ 1.64
Surface Resistivity / M Ω 1.9 × 10 8 ~6.4 × 10 8