説明
High temperature co-fired ceramic (HTCC) is a kind of ceramic substrate with high thermal conductivity and high density, which is made of pre-designed circuit with metal paste by punching, filling and printing, and then laminated and sintered at high temperature.
Aluminum nitride HTCC technology is suitable for high-density packaging modules and components.
It is of great significance to reduce the volume and weight of modules and improve the integration of modules.
Aluminum nitride HTCC technology is suitable for high-density packaging modules and components.
It is of great significance to reduce the volume and weight of modules and improve the integration of modules.
応用:
1) Aerospace, large computer, missile and other electronic equipment, LED etc.
2) UVCLED
3) Plate heater
4) 5G communication base station
特徴:
1) Miniaturization
2) High performance
3) Multi-function
4) High reliability
5) Low cost
XCSA can develop and produce aluminum nitride metallized HTCC products according to customer needs, Welcome to contact us!
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