説明
6 layer Rigid-flex PCB with RoHs
| Technical Capability of rigid-flex PCB | ||||||||||||
| アイテム | Mass production | Small batch | ||||||||||
| Max Layer count | 16 | 20 | ||||||||||
| Structural style(Rigid layers count/Flex layers count) | 16L/8L | |||||||||||
| Min/Max board size(mm) | 15*10/560*406 | 15*10/560*406 | ||||||||||
| Finished Thickness(mm) | 0.35-3.0 | 0.3-3.2 | ||||||||||
| Finished Thickness tolerance | ±10%(>1.0mm)/±0.1mm(≤1.0mm) | ±10%(>1.0mm)/±0.1mm(≤1.0mm) | ||||||||||
| Flex core dielectric type | PI | PI | ||||||||||
| Rigid material type | High Tg/Middle Tg/Common Tg FR4 | High Tg/Middle Tg/Common Tg FR4; PI;High frequency,High speed | ||||||||||
| Cover film thickness(um) | 28/50/60/80 | 28/50/60/80 | ||||||||||
| Adhesive thickness(um) | 25/40/50/65 | 25/40/50/65 | ||||||||||
| Min./Max.copper thickness (um) | 12/70 | 12/70 | ||||||||||
| Flex material dielectric thickness, Min./Max. (um) | 25~75 | 25~75 | ||||||||||
| Mechnical drill, 分. | 0.20mm | 0.20mm | ||||||||||
| Hole position tolerance | ±2mil | ±2mil | ||||||||||
| hole center to center, 分. | 0.5mm | 0.5mm | ||||||||||
| PTH Aspect ratio, マックス. | 8:1 (through);0.8:1 (blind) | 12:1 (through);0.8:1 (blind) | ||||||||||
| Laser drill diameter | 4-6mil | 4-6mil | ||||||||||
| 分. track width/space(Hoz material) | 3.5mil/3.5mil | 3.5mil/3.5mil | ||||||||||
| Inner layer track width tolerance | ±10% | ±10% | ||||||||||
| Spilled glue amount of Rigid&flex joint max. | 1.0mm | 1.0mm | ||||||||||
| Graphic to edge of rigid&flex Min. | 20mil | 20mil | ||||||||||
| PTH wall to edge of joint of rigid&flex, 分. | 20mil | 20mil | ||||||||||
| PTH to track in inner layer(mil), 分. | 8 | 7 | ||||||||||
| Flex area length, 分. | 5mm | 4mm | ||||||||||
| Bending radius, 分. | 6*厚さ | 3*厚さ | ||||||||||
| Outline size tolerance | ±0.13mm | ±0.1mm | ||||||||||
| PAD size tolerance | ±20% | ±20% | ||||||||||
| Soldermask registration/min.soldermask bridge | 2mil/4mil | 2mil/4mil | ||||||||||
| Stiffener material | PI/FR4/Steel | PI/FR4/Steel | ||||||||||
| Stiffener registration/Spilled glue length | 8mil/3mil | 8mil/3mil | ||||||||||
| Cover film soldermask opening/Min.Cover film bridge | Φ0.5mm/0.3mm | Φ0.5mm/0.3mm | ||||||||||
| Cover film registration/Spilled glue length | 2mil | 2mil | ||||||||||
| Min BGA Pitch(mm) | 0.5 | 0.4 | ||||||||||
| Material brand of rigid | Shengyi,ITEQ,Rogers | |||||||||||
| Material brand of flex | Shengyi,taihong,dupont,panasonic | |||||||||||