2018 High Quality Aluminium Based Metal Core PCB

מספר דגם.
Aluminium PCB-4

חוֹמֶר
Aluminum

Board Thickness
0.8מ"מ,1.0מ"מ,1.2מ"מ,1.6מ"מ,2.0מ"מ,2.2מ"מ

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Ccl Brand
Jh,Ccaf.etc

Sample Date
3-5ימים

חבילת הובלה
Vacuum Packing

מִפרָט
SGS UL ISO

סִימָן מִסחָרִי
ZAPON

מָקוֹר
חרסינה

קוד HS
85340090

קיבולת ייצור
50.000sqm/Month

תיאור

תיאור מוצר:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-א, CCAF-05וכו. And 0.8mm, 1.0מ"מ, 1.5מ"מ, 2.0מ"מ, וכו.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600מ"מ (20″×, 24″); 600mm ×, 1060מ"מ (24″×, 42″)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5מ"מ
Technique parameter:

Test item Technology request יְחִידָה Test result
1 Peel Strength א 1.8 N/mm 2
After thermal stress (260ordm;ג) 1.8 N/mm 1.8
2 Blister test AfterThermal stress (260ºC, 2דקה ) No delaminating / Ok
3 Flammability(א) FV-O / FV-O
4 Thermal resistance 2.0 ordm;C /W 1
5 Surface Resistivity א 1 × 10 5 M Ω 5 × 10 7
Constant humidity treatment 1 × 10 5 M Ω 2 × 10 6
(90%,3 5 ordm;ג,96h)
6 Volume Resistivity א 1 × 10 6 M Ω· m 4 × 10 8
Constant humidity treatment 1 × 10 6 M Ω· m 5 × 10 7
(90%,3 5ordm;ג ,96h)
7 Dielectric Breakdown ( DC ) 28.5 Kv/mm 31
8 Dielectric constant (1MHz ) 4.4 / 4.2
(40 ordm;ג,93% , 96h )
9 Dielectric dissipation factor (1MHz ) 0.03 / 0.02
(40 ordm;ג, 93% ,96h )