UL E344718 Single Side Aluminum LED PCB

Modèle NON.
Aluminum PCB-16

Application
LED Production

Mechanical Rigid
Rigid

Matériel
Aluminum

Marque
DJ&Zapon

Board Thickness
0.8millimètre, 1.0millimètre, 1.2millimètre, 1.6millimètre, 2.0millimètre, 2.2millimètre

Thermal Conductivity
1.0W/M.K, 1.5W/M.K, 2.0W/M.K, 3.0W/M.K, 4.0W/M.K

Ccl Brand
Jh, Ccaf.etc

Sample Date
3-5jours

Forfait transport
Vacuum Packing

spécification
UL, TS16949, IPC 600 CLASS 2

Marque déposée
ZAPON

Origine
Chine

Code SH
85340090

Capacité de production
5000sqm/Month

La description

Hangzhou Dejia Electronics has passed ISO9001:2008 Quality System Certification, UL and TS16949 Certification, ISO14001 Environment Certification while our products meet RoHS Directive. We operate under ISO9001:2008 Quality System Certification strictly integrating fine management into every production step to ensure our product quality ahead of others in this field.
Our company manufacture massively by mature technology products as follows: streetlight aluminum PCB, fluorescent lamp aluminum PCB, wash wall light aluminum PCB, spotlight aluminum PCB, bulb light aluminum PCB, tunnel lamp aluminum PCB and other aluminum PCBs. So far our business has reached over ten provinces and cities in China; abroad we have clients from America, England, Germany, Turquie, Malaysia, Russia, Japon, Brazil and many other countries.
In June 2012, our company took the first place to bring out 3D bending aluminum PCB widely used in LED lighting, car lamp, backlight and such areas bringing new revolution. The main consumers of 3D bending aluminum PCB were CREE, GE, Volkswagen, Audi, BOE, Topstar, ETi and such famous enterprises at home and abroad.
Nowadays materials used by our company are from Microtek, Juding, Quanbao, Dupon, Beggs and such high-end materials able to manufacture products with coefficient of heat conductivity from 0.5W to 4.0W and to satisfy clientsneeds both at home and abroad.

Alu-PCB(MCPCB)Capability
Non. Article Capabilities
1 Layers 1-2 Layers
2 Finished Thickness 16-134Mil (0.4MM-3.4MM )
3 Max. Dimension 500MM *1200MM
4 Matériel TCB-2AL,CS-AL-88/89,EM-MP,HA80,NRK,JHAF02-1.0,3D Bending,Copper base,DJ-A11
5 Finished Thickness Tolerance ≤1.0MM ±0.10MM -1.6MM ±0.15MM
6 Min.Line Width&Spacing 4Mil (0.1MM )
7 Copper Thickness 35un, 70un,1 to 10oZ
8 Min. Finished Hole Size 0.95MM
9 Min. Drill Size 1.00MM
10 Max. Drill Size 6.5MM
11 Finished Hole Size Tolerance ±0.050MM
12 Aperture Position Precision ±0.076MM
13 Warp & Twist 0.75%
14 Min SMT PAD Size 0.4MM±0.1MM
15 Min.Solder Mask PAD 0.05MM(2Mil)
16 Min.Solder Mask Cover 0.05MM(2Mil)
17 Solder mask Thickness >12un
18 Min.Solder Mask Bridge 0.1MM(4Mil)
19 Finition des surfaces HAL, HALLeadfree,OSP, Immersion Gold, etc
20 HAL Thickness 5-12un
21 Immersion Gold Thickness 1-3 Microinch
22 OSP Film Thickness ENTEK PLUS HT:0.3-0.5un; F2:0.15-0.3un
23 V-CUT Angle 30°,45°,60°
24 V-CUT Thickness 0.4-3.4MM
25 V-CUT Precision ±0.05MM, Up&Down Cut Deviation
±0.05MM,Residual Thickness ±0.05MM
26 Outline Finishing Routing & Punching; Precision Deviation ±0.10MM
27 E-test Voltage 250 ± 5V
28 E-test Resistance 10Ω-100MΩ
29 Peel Strength 288°, 30s ≥1.4
30 Thermal Conductivity 1.0 to 12W/m.k
31 Withstand Voltage CA:1KV pour 6.5KV, CC:1KV pour 8.5KV
32 Thermal Stress 288°,30s Non-Layered No Foaming