La description
Hi buyer,
Thank your for scanning our Rigid-Flex PCB Products.
As is known,PCB is customized product ,so the unit price is not real,details pls contact me and a quotation will be offered.Please send us PCB files in gerber files, “.pcbdoc”, “.lay”, “.lay6” or “.brd” .
Description du produit
Standard Flex Materials:
Polyimide (Kapton) 0.5 mil to 5 mils (.012millimètre – .127millimètre)
Adhesiveless Copper Clad Base Material 1 mil to 5 mils
Flame Retardant Laminate, Matériau de base, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)
Base Copper:
1/3 oz. – .00047 dans. (.012millimètre)–rarely used
1/2 oz. – .0007 dans. (.018millimètre)
1 oz. – .0014 dans. (.036millimètre)
2 oz. – .0028 dans. (.071millimètre)
Solder Mask:
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012millimètre – .127millimètre)
avec 0.5 pour 2 mil Adhesive (.012millimètre – .051millimètre)
LPI and LDI Flexible Soldermasks
Rigid-Flex PCB Capability
| Fastline FPC board and Rigid-flex PCB capability | |
| Technology and Capabilities | |
| Matériel | Polyimide / Polyester |
| Counts | Flex: 1~8L; Rigid-Flex: 2~8L |
| Board Thickness | Min.0.05millimètre ; Max. 0.3millimètre |
| Copper Thickness | 1/3 oz — 2 oz |
| Maximum dimensions | For FPC:250mm*1200mm(normale); 250mm*100,000mm |
| CNC Drill Size (Max) | 6.5millimètre |
| CNC Drill Size (Min) | Flex: 0.15millimètre |
| Holes Location Tolerance | ±0.05mm |
| Coverlay Drill Size (Min) | 0.6millimètre |
| Hole to Coverlay Opening Windows (Min) | 0.15millimètre |
| Min Line Width / Spacing | 0.1/0.1millimètre |
| Aspect Ratio | 61 |
| Copper Thickness on Hole Wall | Flex:12-22μm |
| Min Pad Size | φ0.2mm |
| Etch Tolerance | Finished line width tolerance ±20% |
| Pattern Registration Tolerance | ±0.1mm (Working Panel Size: 250*300millimètre) |
| Coverlay Registration Tolerance | ±0.15mm |
| Solder Mask Registration Tolerance | ±0.2mm |
| Solder Mask to PAD | Non photosensitive: 0.2millimètre Photosensitive: 0.1millimètre |
| Min. Solder Mask Dam | 0.1millimètre |
| Misregistration Tolerance for Stiffener, Adhesive, Glue paper | ±0.30mm |
| Surface Finish | Plating Ni / Au ; Chemical Ni / Au ; OSP |
Would like to know more about the product? Send us inquiry, click “Envoyer” now!
Please feel free to send us gerber file for lastest price and discount!
Contact Person: Lily He
Cellphone: 008618025363532