Fccl – Pi Copper Clad Laminate

Modèle NON.
fccl

Processing Technology
Delay Pressure Foil

Matériau de base
Cuivre

Insulation Materials
Organic Resin

Forfait transport
Cartoon

spécification
250MM*100M

Marque déposée
fw

Origine
Chine

Capacité de production
50000

La description

FCCL – PI Copper Clad Laminate

La description:

SPECIFICATION:

Base PI film: 0.5 ~ 2.0mils thickness;
Copper foil: EDHD & RA copper both available, 1/3, 1/2, 1.0 & 2.0 Oz thicknesses;
Adhesive: Modified epoxy adhesive, 0.5 ~ 0.7 mils;
Laminate structure: Single side & Double sides both available;

FEATURE:

  • Meet the RoHS requirement & halogen free, and pass SGS certificate.
  • Higher bond strength, good dielectric properties
  • Excellent chemical and solvent resistance, good solder heating resistance.
  • Excellent dimensional stability.

APPLICATION: Widely used in the data communication, aerospace,

personal computer and automotive fields.

Especially recommended to the following types of FPC(Flexible Printed Circuit) customers:

  1. Customers who are troubled by current FCCL stack-up(PI and copper layer),so couldn’t satisfy latest design trend of small, short and light-weighted for electronic products.
  2. Customers who use the method of “selective copper plating” in the Pattern Process scène.

    In the Pattern Process stage, the copper layer is grown by the method of “selective copper plating”, and then the excess copper is etched with chemical liquid, leaving the circuit they need.
    (The advantage of our FCCL: Thickness of copper layer is ranged from 2um to 8um, which shortens process time and risk of undercut during patterning.)