2018 High Quality Aluminium Based Metal Core PCB

Modèle NON.
Aluminium PCB-4

Matériel
Aluminum

Board Thickness
0.8millimètre,1.0millimètre,1.2millimètre,1.6millimètre,2.0millimètre,2.2millimètre

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Ccl Brand
Jh,Ccaf.etc

Sample Date
3-5jours

Forfait transport
Vacuum Packing

spécification
SGS UL ISO

Marque déposée
ZAPON

Origine
Chine

Code SH
85340090

Capacité de production
50.000sqm/Month

La description

Description du produit:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-UN, CCAF-05etc. And 0.8mm, 1.0millimètre, 1.5millimètre, 2.0millimètre, etc.
Thickness of the copper: 18un, 35un, 70un, 105un.
Base size: 500mm ×, 600millimètre (20″×, 24″); 600mm ×, 1060millimètre (24″×, 42″)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35un
Thickness of the diclectric: 70un
Thickness of the aluminum-base: 1.5millimètre
Technique parameter:

Test item Technology request Unit Test result
1 Peel Strength UN 1.8 N/mm 2
After thermal stress (260ordm;C) 1.8 N/mm 1.8
2 Blister test AfterThermal stress (260C, 2min ) No delaminating / Ok
3 Flammability(UN) FV-O / FV-O
4 Thermal resistance 2.0 ordm;C /W 1
5 Surface Resistivity UN 1 × 10 5 M Ω 5 × 10 7
Constant humidity treatment 1 × 10 5 M Ω 2 × 10 6
(90%,3 5 ordm;C,96h)
6 Volume Resistivity UN 1 × 10 6 M Ω· m 4 × 10 8
Constant humidity treatment 1 × 10 6 M Ω· m 5 × 10 7
(90%,3 5ordm;C ,96h)
7 Dielectric Breakdown ( CC ) 28.5 Kv/mm 31
8 Dielectric constant (1MHz ) 4.4 / 4.2
(40 ordm;C,93% , 96h )
9 Dielectric dissipation factor (1MHz ) 0.03 / 0.02
(40 ordm;C, 93% ,96h )