Descripción
PCB capability
| Items | Mass production | Mass production | Prototype |
| Layers | 32L | 6L | 40L |
| Board type | Rigid PCB | FPC | Rigid&flex |
| HDI Stackup | 4+n+4 | N/A | Any layer |
| máx.. Board Thickness | 10milímetro(394mil) | 0.30milímetro | 14milímetro(551mil) |
| mín.. Ancho | Inner Layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Outer Layer | 2.5/2.5mil | 2.2/2.2mil | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±5mil | ±4mil | |
| máx.. Copper Thickness | 6oz | 12oz | |
| mín.. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1milímetro(4mil) | 0.050milímetro(2mil) | |
| máx.. Tamaño (Finish Size) | Line-card | 850mm*570mm | 1000mm*600mm |
| Backplane | 1250mm*570mm | 1320mm*600mm | |
| Aspect Ratio (Finish Hole) | Line-card | 14:1 | 18:1 |
| Backplane | 16:1 | 28:1 | |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| Alta velocidad | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG | ||
