Descripción
PCB capability
| Items | Mass production | Mass production | Prototype |
| Layers | 32L | 6L | 40L |
| Board type | Rigid PCB | FPC | Rigid&flex |
| HDI Stackup | 4+n+4 | N/A | Any layer |
| máx.. Board Thickness | 10milímetro(394mil) | 0.30milímetro | 14milímetro(551mil) |
| mín.. Ancho | Inner Layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Outer Layer | 2.5/2.5mil | 2.2/2.2mil | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±5mil | ±4mil | |
| máx.. Copper Thickness | 6oz | 12oz | |
| mín.. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1milímetro(4mil) | 0.050milímetro(2mil) | |
| máx.. Tamaño (Finish Size) | Line-card | 850mm*570mm | 1000mm*600mm |
| Backplane | 1250mm*570mm | 1320mm*600mm | |
| Aspect Ratio (Finish Hole) | Line-card | 14:1 | 18:1 |
| Backplane | 16:1 | 28:1 | |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| Alta velocidad | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG | ||
PCBA capability
| Process | Artículo | Mass production capability | |
| SMT | Impresión | Max PCB size | 900*600mm² |
| Max PCB weight | 8kg | ||
| Solder paste printing tolerance | ±25μm(6σ) | ||
| System repeat calibration tolerance | ±10μm(6σ) | ||
| Scraper pressure detection | pressure closed-loop control system | ||
| SPI | Detect Min BGA PAD to PAD distance | 100μm | |
| x-axis and Y-axis tolerance | 0.5μm | ||
| False Rate | ≤0.1% | ||
| Mount | Component size | 0.3*0.15 mm²–200*125 mm² | |
| Component max height | 25.4milímetro | ||
| Populate Max component weight | 100gramo | ||
| BGA/CSP Min PAD spacing, and Min PAD diameter | 0.30milímetro,0.15milímetro | ||
| Populate tolerance | ±22μm(3σ),±0.05°(3σ) | ||
| PCB board size | 50*50 mm²-850*560 mm² | ||
| PCB thickness | 0.3milímetro–6milímetro | ||
| Max PCB weight | 6kg | ||
| Populate Max components type | 500 | ||
| AOI | Detect Min components | 01005 | |
| Detect false type | Incorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball | ||
| Foot warping detection | 3D Detection function | ||
| Reflow | Temperature Accuracy | ±1ºC | |
| Welding protection | nitrogen protection;(remaining oxygen<3000ppm) | ||
| Nitrogen Control | Nitrogen closed-loop control system,±200ppm | ||
| 3D X-Ray | Magnification | Geometric Magnification;:2000 veces;System Magnification:12000veces | |
| Resolución | 1μm /nm | ||
| Rotation Angle &Slanting Perspective | Any ±45°+360°rotation | ||
| DIP | Preelaboration | Automatic forming technology | Component Automatic forming |
| DIP | DIP technology | Automatic Insertion machine | |
| Wave soldering | Wave soldering type | Ordinary wave soldering | |
| Inclination angle of transport guide rail | 4–7° | ||
| Temperature accuracy | ±3ºC | ||
| Soldering protection | nitrogen protection | ||
| Non-welding pressure contact technology | Max PCB board size | 800*600mm² | |
| Press down height accuracy | ±0.02mm | ||
| Pressure Range | 0-50KN | ||
| Pressure Accuracy | Standard value:±2% | ||
| Hold time | 0-9.999S | ||
| Conformal coating technology | Max PCB board size | 500*475*6milímetro | |
| Max PCB board weight | 5kg | ||
| Min Nozzle size | 2milímetro | ||
| Other characteristic | Conformal coating pressure Programmable control | ||
| ICT test | test level | Device level test,Test hardware connection status. | |
| Test point | >4096 | ||
| Test content | Contact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test. | ||
| Assembly and test | Production type | TouchPad | Mass production |
| TWS | Mass production | ||
| Baby Camera | Mass production | ||
| Gaming controller | Mass production | ||
| Life Watch | Mass production | ||
| FT test | test level | PCB board system level test.Test System function status. | |
| Temperature cycling test | Rango de temperatura | -60ºC–125ºC | |
| Rise/lower temperature rate | >10ºC/min | ||
| Temperature tolerance | ≤2ºC | ||
| Other Reliability test | burn-in test,Drop test, vibration test , Abrasion test ,Key life test. | ||
