Flexible Printed Circuit Boards PCB with Immersion Gold,

Αριθμός Μοντέλου.
UC-1124

Application
Medical Instruments

Mechanical Rigid
Fexible

Υλικό
Paper Phenolic Copper Foil Substrate

Μάρκα
Uc

Ipc Standards
IP Class -2

Copper Thickness
1oz

Surface Finihsing
Immersion Gold

Χρόνος ανοχής
6-8 Working Days

Πακέτο μεταφοράς
Vacuum Packing

Προσδιορισμός
UL(US&Canada). ISO. RoHs, TS, SGS

Εμπορικό σήμα
Ucreate PCB

Προέλευση
Shenzhen, Κίνα

Κωδικός HS
8534009000

Παραγωγική ικανότητα
5000sq. M/Month

Περιγραφή

Ucreate LTD PCB’s aim:

Customer Satisfaction is Always Our First Priority!


*Quality Policy

*Top Quality and high efficiency

*Improve continuously

*Achieve customer’s satisfaction

1.Products Application

2. Market Distribution

Flexible Printed Circuit Boards PCB with Immersion Gold,


3.Technical Capabilities

Items Speci. Remark
Max panel size 32x 20.5″(800mm x 520mm)
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz
Outer copper thickness 0.5~6 oz
Finished board thickness 0.4-3.2 mm
Board thickness tolerance control ±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation
Layer count Capability 1-30 LAYER
alignment between ML ±2mil
Min drilling 0.15 mm
Min finished hole 0.1 mm
Hole precision ±2 mil(±50 um)
tolerance for Slot ±3 mil(±75 um)
tolerance for PTH ±3 mil(±75um)
tolerance for NPTH ±2mil(±50um)
Max Aspect Ratio for PTH 8:1
Hole wall copper thickness 15-50um
Alignment of outer layers 4mil/4mil
Min trace width/space for outer layer 4mil/4mil
Tolerance of Etching +/-10%
Thickness of solder mask on trace 0.4-1.2mil(10-30um)
at trace corner ≥0.2mil(5um)
On base material ≤+1.2mil
Finished thickness
Hardness of solder mask 6H
Alignment of solder mask film ±2mil(+/-50um)
Min width of solder mask bridge 4mil(100um)
Max hole with solder plug 0.5mm
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger 280u”(7um)
Max gold thickness for Gold finger 30u”(0.75um)
Nickel thickness in Immersion Gold 120u”/240u”(3um/6um)
Gold thickness in Immersion Gold 2u”/6u”(0.05um/0.15um)
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength ≥61B/in(≥107g/mm)
bow and twist
0.75%


4.Products Equipment

Flexible Printed Circuit Boards PCB with Immersion Gold,

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