Custom Single/Double/Multilayer 94V0 RoHS Printed Circuit Board PCBA Assembly PCB Board

Αριθμός Μοντέλου.
01

Processing Technology
Electrolytic Foil

Base Material
Aluminum

Insulation Materials
Organic Resin

Μάρκα
Oyk

Παραγωγική ικανότητα
10000

Περιγραφή

t’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
The tapy and specification of Aluminum based PCB CCAF-01, CCAF-04-ΕΝΑ, And 0.8mm, 1.0mm, 1.5mm, 2.0mm, και τα λοιπά.
Thickness of the copper: 18um, 35um, 70um, 105um.

It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
The tapy and specification of Aluminum based PCB CCAF-01, CCAF-04-ΕΝΑ, And 0.8mm, 1.0mm, 1.5mm, 2.0mm, και τα λοιπά.
Thickness of the copper: 18um, 35um, 70um, 105um.

Technique parameter:

Είδος
Test item
Technology request
Unit
Test result
1
Peel Strength
ΕΝΑ
≥ 1.0
N/mm
1.05
After thermal stress (260 ordm;ντο )
≥ 1.0
N/mm
1.05
2
Blister test AfterThermal stress (288 ordm;ντο, 2min)
288ordm;ντο 2 min
No delaminating

/
OK
3
Themal Resistance
2.0
ordm;C /W
0.65
4
Flammability(ΕΝΑ)
FV-O
/
FV-O
5
Surface Resistivity
ΕΝΑ
≥ 1 × 10 5
M Ω
5.0 × 10 7
Constant humidity treatment
(90%,3 5 ordm;ντο ,96h)

≥ 1 × 10 5
M Ω
4.5 × 10 6
6
7

Volume Resistivity
ΕΝΑ
≥ 1 × 10 6
M Ω· m
1.0 × 10 8
Constant humidity treatment
(90%,3 5 ordm;ντο ,96h)

≥ 1 × 10 6
M Ω· m
1.9 × 10 7
8
Dielectric Breakdown (DC )
≥ 25
Kv/mm
31
9
Dielectric constant (1MHz)
(40 ordm;ντο, 93% , 96h)

4.4
/
4.2
10
Dielectric dissipation factor (1MHz )
(40ordm;ντο ,93%,96h)

0.03
/
0.029
Accelerated aging experiment
(125 ordm;ντο ,2000h)

The laminate bace should no wrinkles,no crack,no delaminating or no pine
/
OK
11
High low temperature impact test
(-50 ordm;ντο, 15min, 80ordm;ντο , 15minTOTAL DO 15 ~ 20 Circulation)
Peel Strength
/
N/mm
1.39 ~ 1.64
Surface Resistivity
/
M Ω
1.9 × 10 8 ~6.4 × 10 8