1.6mm Aluminium PCB for Lighting Industry

Αριθμός Μοντέλου.
Aluminium PCB-3

Board Thickness
0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Ccl Brand
Jh,Ccaf.etc

Sample Date
3-5ημέρες

Πακέτο μεταφοράς
Vacuum Packing

Προσδιορισμός
UL, TS16949, IPC 600 CLASS 2

Εμπορικό σήμα
ZAPON

Προέλευση
CHINA

Κωδικός HS
85340090

Παραγωγική ικανότητα
50000sqm/Month

Περιγραφή

Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.

It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.

Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-ΕΝΑ, CCAF-05και τα λοιπά. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, και τα λοιπά.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm × , 600mm (20″× , 24″); 600mm × , 1060mm (24″× , 42″)

CCAF-04-A Aluminum-base copper-clad laminate
The test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 80um(matrial of the high heat dissipation)
Thickness of the aluminum-base: 1.5mm

The result of the test:

Test item Technology request Unit Test result
1 Peel Strength ΕΝΑ ≥ 1.0 N/mm 1.05
After thermal stress (260 ordm;ντο ) ≥ 1.0 N/mm 1.05
2 Blister test AfterThermal stress (288 ordm;ντο, 2min) 288ordm;ντο 2 min
No delaminating		 / OK
3 Themal Resistance ≤ 2.0 ordm;C /W 0.65
4 Flammability(ΕΝΑ) FV-O / FV-O
5 Surface Resistivity ΕΝΑ ≥ 1 × 10 5 M Ω 5.0 × 10 7
Constant humidity treatment
(90%,3 5 ordm;ντο ,96h)		 ≥ 1 × 10 5 M Ω 4.5 × 10 6
6
7		 Volume Resistivity ΕΝΑ ≥ 1 × 10 6 M Ω@ m 1.0 × 10 8
Constant humidity treatment
(90%,3 5 ordm;ντο ,96h)		 ≥ 1 × 10 6 M Ω@ m 1.9 × 10 7
8 Dielectric Breakdown (DC ) ≥ 25 Kv/mm 31
9 Dielectric constant (1MHz)
(40 ordm;ντο, 93% , 96h)		 ≤ 4.4 / 4.2
10 Dielectric dissipation factor (1MHz )
(40ordm;ντο ,93%,96h)		 ≤ 0.03 / 0.029
Accelerated aging experiment
(125 ordm;ντο ,2000h)		 The laminate bace should no wrinkles,no crack,no delaminating or no pine / OK
11 High low temperature impact test
(-50 ordm;ντο, 15min, 80ordm;ντο , 15minTOTAL DO 15 ~ 20 Circulation) 		Peel Strength / N/mm 1.39 ~ 1.64
Surface Resistivity / M Ω 1.9 × 10 8 ~6.4 × 10 8