Beschreibung
F Interposer Characteristics
BGA169 eMMC Test Socket with F interposer
• F Solution is designed for fast validation & test of IC chip like eMMC, DRAM, eMCP, UFS, FLASH, LPDDR3, LPDD4, and CPU as well.
• Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after de-soldering.
• The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate while reducing board cost.
• “Buy and use” design and with fully removable double latch turning lid bring customers big convenience.
• Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy maintenance.
• Customized interposer development.
• The F1 interposer is with some pinout based on F interposer, providing signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an oscilloscope. Für mehr Details, please refer to our F1 solution.
| Mechanical | |
| Material Socket Body | Peek Ceramic |
| Material Socket Lid | AL, Cu, POM |
| Kontakt | Pogo Pin |
| Operation Temperature | -40 ~ 140 °C |
| Life Span | 100K Cycles |
| Spring Force | 20g ~ 30g per Pin |
| Elektrisch | |
| Current Rating | 1.0 ~ 2.0A |
| DC Resistance | max. 100mΩ |
Solder the Interposer onto mainboard,screw socket to the interposer, and insert the device to be tested, place and lock the lid, then screw down the heat sink actuator for device engagement. Now it is ready for use.
Advantages with F solution are convenience,high efficiency,compact structure,cost-effective, is called kind of “buy and use” modular.
Main applications are for test, debug & validation of devices of BGA, LGA, QFP, QFN, SOP used on smart phone, tablet PC, wearable devices, TV board, etc.
A lot of F solutions have been provided to our customers for their memory IC chips like eMMC, eMCP, FLASH, DDR, UFS and CPU devices as well.
Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.
| Part Number | Name | Beschreibung | Paket |
| 702-0000159 | F Solution | BGA153 0.5mm eMMC DT100 11.5x13mm F A | BGA153 |
| 702-0000175 | F Solution | BGA221 0.5mm eMCP DT100 11.5x13mm F A | BGA221 |
| 702-0000176 | F Solution | BGA63 0.8mm DT100 9x11mm F A | BGA63 |
| 702-0000177 | F Solution | BGA168 0.5mm LPDDR DT100 12x12mm F A | BGA168 |
| 702-0000181 | F Solution | BGA78 0.8mm DDR DT100 10.5x12mm F A | BGA78 |
| 702-0000185 | F Solution | BGA96 0.8mm DDR DT100 9x14mm F A | BGA96 |
| 702-0000186 | F Solution | BGA96 0.8mm DDR DT100 9x13mm F A | BGA96 |
| 702-0000187 | F Solution | BGA78 0.8mm DDR DT100 9×10.5mm F A | BGA78 |
| 702-0000188 | F Solution | BGA78 0.8mm DDR DT100 9×11.1mm F A | BGA78 |
| 702-0000189 | F Solution | BGA84 0.8mm DDR DT100 8×12.5mm F A | BGA84 |
| 702-0000203 | F Solution | BGA153 0.5mm eMMC DT100 10x11mm F A | BGA153 |
| 702-0000204 | F Solution | BGA169 0.5mm eMMC DT100 12x16mm F A | BGA169 |
| 702-0000205 | F Solution | BGA169 0.5mm eMMC DT100 12x18mm F A | BGA169 |
| 702-0000206 | F Solution | BGA169 0.5mm eMMC DT100 14x18mm F A | BGA169 |
| 702-0000207 | F Solution | BGA162 0.5mm eMCP DT100 11.5x13mm F A | BGA162 |
| 702-0000210 | F Solution | BGA216 0.4mm DT100 12x12mm F A | BGA216 |
| 702-0000211 | F Solution | BGA134 0.65mm DT100 10×11.5mm F A | BGA134 |
| 702-0000212 | F Solution | BGA107 0.8mm DT100 10.47×12.99mm F A | BGA107 |
| 702-0000213 | F Solution | BGA107 0.8mm DT100 11.5x13mm F A | BGA107 |
| 702-0000215 | F Solution | BGA63 0.8mm DT100 9.5x12mm F A | BGA63 |
| 702-0000216 | F Solution | BGA96 0.8mm DDR DT100 10x14mm F A | BGA96 |
| 702-0000217 | F Solution | BGA130 0.65mm MCP DT100 8x9mm F A | BGA130 |
| 702-0000218 | F Solution | BGA100 1.0mm Nand DT100 14x18mm F A | BGA100 |
| 702-0000219 | F Solution | BGA152 1.0mm Nand DT100 14x18mm F A | BGA152 |
| 702-0000220 | F Solution | BGA132 1.0mm Nand DT100 12x18mm F A | BGA132 |
| 702-0000221 | F Solution | BGA136 1.0mm Nand DT100 14×16.5mm F A | BGA136 |
| 702-0000225 | F Solution | LGA60 1.41mm Nand DT100 11x14mm F A | LGA60 |
| 702-0000226 | F Solution | LGA60 1.41mm Nand DT100 12x17mm F A | LGA60 |
| 702-0000227 | F Solution | LGA52 1.41mm Nand DT200 12x20mm F A | LGA52 |
| 702-0000229 | F Solution | LGA60 1.41mm Nand DT100 13x18mm F A | LGA60 |
| 702-0000230 | F Solution | LGA52 1.41mm Nand DT100 14x18mm F A | LGA52 |
| 702-0000233 | F Solution | BGA96 0.8mm DDR DT100 9x13mm F A | BGA96 |
| 702-0000240 | F Solution | BGA78 0.8mm DDR DT100 7.5x11mm F A | BGA78 |
| 702-0000244 | F Solution | BGA78 0.8mm DDR DT100 8×10.5mm F A | BGA78 |
| 702-0000249 | F Solution | BGA78 0.8mm DDR DT100 9×10.6mm F A | BGA78 |
| 702-0000251 | F Solution | BGA78 0.8mm DDR DT100 9×11.5mm F A | BGA78 |
| 702-0000255 | F Solution | BGA78 0.8mm DDR DT100 9.4×11.1mm F A | BGA78 |
| 702-0000258 | F Solution | BGA78 0.8mm DDR DT100 10x11mm F A | BGA78 |
| 702-0000262 | F Solution | BGA144 0.8mm DRAM DT100 11×18.5mm F A | BGA144 |
| 702-0000266 | F Solution | BGA95 0.65mm UFS DT100 11.5x13mm F A | BGA95 |
| 702-0000267 | F Solution | BGA96 0.8mm DDR DT100 7.5x13mm F A | BGA96 |
| 702-0000268 | F Solution | BGA96 0.8mm DDR DT100 7.5×13.3mm F A | BGA96 |
| 702-0000277 | F Solution | BGA96 0.8mm DDR DT100 9.4x13mm F A | BGA96 |
| 702-0000278 | F Solution | BGA96 0.8mm DDR DT100 10×13.3mm F A | BGA96 |
| 702-0000280 | F Solution | BGA96 0.8mm DDR DT100 11×13.3mm F A | BGA96 |
| 702-0000281 | F Solution | BGA170 0.8mm DDR DT100 12x14mm F A | BGA170 |
| 702-0000282 | F Solution | BGA136 0.8mmDDR DT100 10x14mm F A | BGA136 |
| 702-0000283 | F Solution | BGA136 0.8mmDDR DT100 11x14mm F A | BGA136 |
| 702-0000284 | F Solution | BGA136 0.8mmDDR DT100 12x14mm F A | BGA136 |
| 702-0000285 | F Solution | BGA137 0.8mm MCP DT100 10.5x13mm F A | BGA137 |
| 702-0000286 | F Solution | BGA137 0.8mm MCP DT100 11.5x13mm F A | BGA137 |
| 702-0000295 | F Solution | BGA88 0.8mm DT100 8x10mm F A | BGA88 |
| 702-0000297 | F Solution | BGA88 0.8mm DT100 11x11mm F A | BGA88 |
| 702-0000298 | F Solution | BGA88 0.8mm DT100 8×11.6mm F A | BGA88 |
| 702-0000325 | F Solution | BGA136 0.8mm eMCP DT100 10.5x13mm F A | BGA136 |
| 702-0000418 | F Solution | BGA178 0.65mm LPDDR DT100 11×11.5mm F A | BGA178 |
| 702-0000627 | F Solution | TSOP48 0.5mm Nand DT100 12x20mm F A | TSOP48 |
| 702-0000666 | F Solution | QFP256 0.4mm DT125 28x28mm F A | QFP256 |
| 702-0000667 | F Solution | QFP176 0.4mm DT100 20x20mm F A | QFP176 |
| 702-0000671 | F Solution | QFN88 0.5mm BF504F CS 12x12mm | QFN88 |
| 702-0000725 | F Solution | BGA96 0.8mm DDR DT100 7.5×13.5mm F A | BGA96 |
| 702-0000743 | F Solution | LGA118 2.0mm RF module CT 27.2×25.2mm | LGA118 |
| 702-0000842 | F Solution | BGA168 0.5mm LPDDR DT100 12x12mm F A | BGA168 |
| 702-0000945 | F Solution | BGA169 0.5mm eMMC DT100 12x16mm F A | BGA169 |
| 702-0000949 | F Solution | BGA132 1.0mm Nand DT100 12x18mm F A | BGA132 |
| 702-0001074 | F Solution | BGA100 1.0mm eMMC DT100 14x18mm F A NB | BGA100 |
| 702-0001075 | F Solution | BGA100 1.0mm eMMC DT100 14x18mm F A BA | BGA100 |
| 702-0001076 | F Solution | BGA78 0.8mm DDR DT100 8x12mm F A | BGA78 |
| 702-0001149 | F Solution | BGA254 0.5mm eMCP DT100 11.5x13mm F A | BGA254 |
| 702-0000624 | F1 Solution | BGA153 0.5mm eMMC DT100 11.5x13mm F1 A | BGA153 |
| 702-0000723 | F1 Solution | BGA162 0.5mm eMCP DT100 11.5x13mm F1 A | BGA162 |
| 702-0000791 | F1 Solution | BGA221 0.5mm eMCP DT100 11.5x13mm F1 A | BGA221 |
| 702-0000953 | F1 Solution | BGA153 0.5mm UFS DT-mini 11.5x13mm F1 | BGA153 |
| 702-0001026 | F1 Solution | BGA254 0.5mm eMCP DT100 11.5x13mm F1 | BGA254 |
| 702-0001085 | F1 Solution | BGA100 1.0mm eMMC DT100 14x18mm F1 A | BGA100 |
Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.
Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.
Be the world’s leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.
Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
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2) National High Technology Expertise
Sireda has been authorized as National High Technology Expertise.
Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.
Sireda is highly recognized by industry professionals as a company with growth potential.
| No MOQ | No MOQ limitation here. Our cooperation can begin with the sample and provide quality assurance to you before mass production. |
| High Cost Performance | We provide products with high quality and competitive price. |
| Technical Support | We have a professional R & D team and all the engineers have more than 5 Jahre’ experience. So we have the ability to design and produce best products according to our customers’ requirements. |
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