Custom Single/Double/Multilayer 94V0 RoHS Printed Circuit Board PCBA Assembly PCB Board

Modell Nr.
01

Processing Technology
Electrolytic Foil

Base Material
Aluminum

Insulation Materials
Organic Resin

Marke
Oyk

Produktionskapazität
10000

Beschreibung

t’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
The tapy and specification of Aluminum based PCB CCAF-01, CCAF-04-EIN, And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.

It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
The tapy and specification of Aluminum based PCB CCAF-01, CCAF-04-EIN, And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.

Technique parameter:

Artikel
Test item
Technology request
Einheit
Test result
1
Peel Strength
EIN
≥ 1.0
N/mm
1.05
After thermal stress (260 ordm;C )
≥ 1.0
N/mm
1.05
2
Blister test AfterThermal stress (288 ordm;C, 2min)
288ordm;C 2 min
No delaminating

/
OK
3
Themal Resistance
≤ 2.0
ordm;C /W
0.65
4
Flammability(EIN)
FV-O
/
FV-O
5
Surface Resistivity
EIN
≥ 1 × 10 5
M Ω
5.0 × 10 7
Constant humidity treatment
(90%,3 5 ordm;C ,96H)

≥ 1 × 10 5
M Ω
4.5 × 10 6
6
7

Volume Resistivity
EIN
≥ 1 × 10 6
M Ω· m
1.0 × 10 8
Constant humidity treatment
(90%,3 5 ordm;C ,96H)

≥ 1 × 10 6
M Ω· m
1.9 × 10 7
8
Dielectric Breakdown (DC )
≥ 25
Kv/mm
31
9
Dielektrizitätskonstante (1MHz)
(40 ordm;C, 93% , 96H)

≤ 4.4
/
4.2
10
Dielectric dissipation factor (1MHz )
(40ordm;C ,93%,96H)

≤ 0.03
/
0.029
Accelerated aging experiment
(125 ordm;C ,2000H)

The laminate bace should no wrinkles,no crack,no delaminating or no pine
/
OK
11
High low temperature impact test
(-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation)
Peel Strength
/
N/mm
1.39 ~ 1.64
Surface Resistivity
/
M Ω
1.9 × 10 8 ~6.4 × 10 8