Pulse Micro Current Circuit Board PCBA

Model nr.
pcba

Base Material
Copper

Insulation Materials
Epoxy Resin

Surface Finish
Enig

Min Hole
0.20mm

Testing
100% Electrical Testing

Layer Count
10

Manufacturing Standard(S)
Ipc-6012b, Class 2

Copper Thickness
0.5/1oz

Via Plugging
Solder Mask Ink

Transportpakke
Vacuum Package

Specifikation
95.00 mm x102.00 mm

Varemærke
KC

Oprindelse
Shenzhen

HS kode
8534001000

Produktionskapacitet
5000

Beskrivelse

PCB capability

Items Mass production Mass production Prototype
Layers 32L 6L 40L
Board type Rigid PCB FPC Rigid&flex
HDI Stackup 4+n+4 N/A Any layer
Maks. Board Thickness 10mm(394mil) 0.30mm 14mm(551mil)
Min. Width Inner Layer 2.2mil/2.2mil 2.0mil/2.0mil
Outer Layer 2.5/2.5mil 2.2/2.2mil
Registration Same Core ±25um ±20um
Layer to Layer ±5mil ±4mil
Maks. Copper Thickness 6oz 12oz
Min. Drill Hole Dlameter Mechanical ≥0.15mm(6mil) ≥0.1mm(4mil)
Laser 0.1mm(4mil) 0.050mm(2mil)
Maks. Størrelse (Finish Size) Line-card 850mm*570mm 1000mm*600mm
Backplane 1250mm*570mm 1320mm*600mm
Aspect Ratio (Finish Hole) Line-card 14:1 18:1
Backplane 16:1 28:1
Materiale FR4 EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF
High Speed Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933
High Frequency Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27
Others Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,
Surface Finish HASL, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG

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