2018 High Quality Aluminium Based Metal Core PCB

Model nr.
Aluminium PCB-4

Materiale
Aluminum

Board Thickness
0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Ccl Brand
Jh,Ccaf.etc

Sample Date
3-5dage

Transportpakke
Vacuum Packing

Specifikation
SGS UL ISO

Varemærke
ZAPON

Oprindelse
Kina

HS kode
85340090

Produktionskapacitet
50.000sqm/Month

Beskrivelse

Produkt beskrivelse:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-EN, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600mm (20″×, 24″); 600mm ×, 1060mm (24″×, 42″)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm
Technique parameter:

Test item Technology request Unit Test result
1 Peel Strength EN 1.8 N/mm 2
After thermal stress (260ordm;C) 1.8 N/mm 1.8
2 Blister test AfterThermal stress (260ºC, 2min ) No delaminating / Ok
3 Flammability(EN) FV-O / FV-O
4 Thermal resistance ≤ 2.0 ordm;C /W 1
5 Surface Resistivity EN 1 × 10 5 M Ω 5 × 10 7
Constant humidity treatment 1 × 10 5 M Ω 2 × 10 6
(90%,3 5 ordm;C,96h)
6 Volume Resistivity EN 1 × 10 6 M Ω· m 4 × 10 8
Constant humidity treatment 1 × 10 6 M Ω· m 5 × 10 7
(90%,3 5ordm;C ,96h)
7 Dielectric Breakdown ( DC ) 28.5 Kv/mm 31
8 Dielectric constant (1MHz ) ≤ 4.4 / 4.2
(40 ordm;C,93% , 96h )
9 Dielectric dissipation factor (1MHz ) ≤ 0.03 / 0.02
(40 ordm;C, 93% ,96h )