وصف
Parameters:
طبقات: 1
Thicknes: 1.6±0.12mm
Min. Hole Size: 0.5مم
المعالجة السطحية: OSP
Applications
LED, LIGHT.
طبقات: 1
Thicknes: 1.6±0.12mm
Min. Hole Size: 0.5مم
المعالجة السطحية: OSP
Applications
LED, LIGHT.
Our main products range from Multilayer PCB,High frequency PCB, Metal base PCB, Hi-Tg heavy copper foil PCB and Mixed Dielectric base PCB, HDI, rigid-flex PCB,and many other customized PCB with special performance which are widely used in Communication, مزود الطاقة, computer, consumer electronics, industrial control, medical device, Aeronautics and Astronautics high technology field and spread over America, Europe and some Asia Districts, achieving their satisfication.
Ucreate has been certificated with ISO9001, ISO14001, UL from US and Canada, all of our products are with ROHS certification.
Technical Capabilities:
| Items | Speci. | ملاحظة | |
| Max panel size | 32″ x 20.5″(800mm x 520mm) | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13مم) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1مم) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 مم | ||
| Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 مم | ||
| Min finished hole | 0.1 مم | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 8:1 | ||
| Hole wall copper thickness | 15-50واحد | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30واحد) | |
| at trace corner | ≥0.2mil(5واحد) | ||
| On base material | ≤+1.2mil Finished thickness |
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| Hardness of solder mask | 6ح | ||
| Alignment of solder mask film | ±2mil(+/-50واحد) | ||
| Min width of solder mask bridge | 4mil(100واحد) | ||
| Max hole with solder plug | 0.5مم | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, غمر الفضة. | ||
| Max Nickel thickness for Gold finger | 280u”(7واحد) | ||
| Max gold thickness for Gold finger | 30u”(0.75واحد) | ||
| Nickel thickness in Immersion Gold | 120u”/240u”(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u”/6u”(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist |
0.75% | ||
Market distributions:
Product equipments:
الشهادات:
