وصف
| Technical Capabilities | |||
| Items | Speci. | ملاحظة | |
| Max panel size | 32″ x 20.5″(800mm x 520mm) | ||
| الأعلى. Board size | 2000×610mm | ||
|
Min. board Thickness |
2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1مم(4mil) | ||
| الأعلى. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1مم(4mil) | ||
| Min. hole size | 0.2مم(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05مم(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6ح | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300الخامس | ||
| Min. blind/buried via | 0.15مم (6mil) | ||
| Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
| مواد | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13مم) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1مم) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 مم | ||
| Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 مم | ||
| Min finished hole | 0.1 مم | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 08:01 | ||
| Hole wall copper thickness | 15-50واحد | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30واحد) | |
| at trace corner | ≥0.2mil(5واحد) | ||
| On base material | ≤+1.2mil | ||
| Finished thickness | |||
| Hardness of solder mask | 6ح | ||
| Alignment of solder mask film | ±2mil(+/-50واحد) | ||
| Min width of solder mask bridge | 4mil(100واحد) | ||
| Max hole with solder plug | 0.5مم | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, غمر الفضة. |
||
| Max Nickel thickness for Gold finger | 280u”(7واحد) | ||
| Max gold thickness for Gold finger | 30u”(0.75واحد) | ||
| Nickel thickness in Immersion Gold | 120u”/240u”(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u”/6u”(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
MCPCB LED Aluminum based PCB
1. PCB layer: Single side
2. PCB Certificate: ISO UL REACH and RoHS
3. مادة: Aluminum
4. Best price with excellent after-service
Our PCB sell well at Eurpe, America and Asia, passed UL ISO Certificates and meet RoHS, REACH standards. We have rich experience in PCB field to serve your needs.
Welcome to contact us for more details and talk further business.
Inquiries are typically answered within 24 ساعات.
Wish you all the best and prosperous business.
| NO | ITEM | MCPCB Technical capabilities |
| 1 | طبقات | 1-3 طبقات |
| 2 | الأعلى. Board size | 2000×610mm |
| 3 | Min. board Thickness | 1-layer 0.8mm |
| 2-layer 1.6mm | ||
| 3- layer 1.8mm | ||
| 4 | Min. line Width/Space | 0.2مم |
| 5 | الأعلى. Copper thickness | 3 OZ |
| 6 | Min. S/M Pitch | 0.15مم |
| 7 | Min. hole size | 0.6مم |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05مم |
| 10 | Hole position deviation | ±0.05mm |
| 11 | Outline tolerance | ±0.10mm |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 ΩNormal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6ح |
| 16 | Thermal stress | 288°C 20Sec |
| 17 | Test Voltage | 50-300الخامس |
| 18 | Min. blind/buried via | 0.2 مم |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | مواد | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |