Flexible Printed Circuit Boards PCB with Immersion Gold,

نموذج رقم.
UC-1124

تطبيق
Medical Instruments

Mechanical Rigid
Fexible

مادة
Paper Phenolic Copper Foil Substrate

ماركة
Uc

Ipc Standards
IP Class -2

سمك النحاس
1أوقية

Surface Finihsing
Immersion Gold

مهلة
6-8 Working Days

حزمة النقل
Vacuum Packing

تخصيص
أول(US&Canada). ISO. RoHs, TS, اس جي اس

علامة تجارية
Ucreate PCB

أصل
Shenzhen, الصين

رمز النظام المنسق
8534009000

السعة الإنتاجية
5000sq. M/Month

وصف

Ucreate LTD PCB’s aim:

Customer Satisfaction is Always Our First Priority!


*Quality Policy

*Top Quality and high efficiency

*Improve continuously

*Achieve customer’s satisfaction

1.Products Application

2. Market Distribution

Flexible Printed Circuit Boards PCB with Immersion Gold,


3.Technical Capabilities

Items Speci. ملاحظة
Max panel size 32x 20.5″(800mm x 520mm)
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer) 5 mil(0.13مم) hole ring width
Min thickness(inner layer) 4 mil(0.1مم) without copper
Inner copper thickness 1~4 oz
Outer copper thickness 0.5~6 oz
Finished board thickness 0.4-3.2 مم
Board thickness tolerance control ±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation
Layer count Capability 1-30 LAYER
alignment between ML ±2mil
Min drilling 0.15 مم
Min finished hole 0.1 مم
Hole precision ±2 mil(±50 um)
tolerance for Slot ±3 mil(±75 um)
tolerance for PTH ±3 mil(±75um)
tolerance for NPTH ±2mil(±50um)
Max Aspect Ratio for PTH 8:1
Hole wall copper thickness 15-50واحد
Alignment of outer layers 4mil/4mil
Min trace width/space for outer layer 4mil/4mil
Tolerance of Etching +/-10%
Thickness of solder mask on trace 0.4-1.2mil(10-30واحد)
at trace corner ≥0.2mil(5واحد)
On base material ≤+1.2mil
Finished thickness
Hardness of solder mask
Alignment of solder mask film ±2mil(+/-50واحد)
Min width of solder mask bridge 4mil(100واحد)
Max hole with solder plug 0.5مم
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, غمر الفضة.
Max Nickel thickness for Gold finger 280u”(7واحد)
Max gold thickness for Gold finger 30u”(0.75واحد)
Nickel thickness in Immersion Gold 120u”/240u”(3um/6um)
Gold thickness in Immersion Gold 2u”/6u”(0.05um/0.15um)
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength ≥61B/in(≥107g/mm)
bow and twist
0.75%


4.Products Equipment

Flexible Printed Circuit Boards PCB with Immersion Gold,

الشهادات:
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