وصف
| Technical Capabilities | |||
| Items | Speci. | ملاحظة | |
| Max panel size | 32″ x 20.5″(800mm x 520mm) | ||
| الأعلى. Board size | 2000×610mm | ||
|
Min. board Thickness |
2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1مم(4mil) | ||
| الأعلى. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1مم(4mil) | ||
| Min. hole size | 0.2مم(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05مم(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6ح | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300الخامس | ||
| Min. blind/buried via | 0.15مم (6mil) | ||
| Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
| مواد | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13مم) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1مم) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 مم | ||
| Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 مم | ||
| Min finished hole | 0.1 مم | ||
1. Reputable manufacturer
2. شهادة: ISO UL RoHS REACH
3.24-hour work time
4. High Quality, competitive Price & Best Service
Our PCB sell well at Eurpe, America and Asia, passed UL ISO Certificates and meet RoHS, REACH standards. We have rich experience in PCB field to serve your needs.
Welcome to contact us for more details and talk further business.
Inquiries are typically answered within 24 ساعات.
Wish you all the best and prosperous business.
| NO | غرض | Technical capabilities |
| 1 | طبقات | 1-12 طبقات |
| 2 | الأعلى. Board size | 2000×610mm |
| 3 | Min. board Thickness | 2-layer 0.25mm |
| 4-layer 0.6mm | ||
| 6-layer 0.8mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | Min. line Width/Space | 0.15مم(4-5mil) |
| 5 | الأعلى. Copper thickness | 10OZ |
| 6 | Min. S/M Pitch | 0.15مم(4-5mil) |
| 7 | Min. hole size | 0.2مم(8mil) |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05مم(2mil) |
| 10 | Hole position deviation | ±0.05mm(2mil) |
| 11 | Outline tolerance | ±0.10mm(4mil) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 Ω Normal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6ح |
| 16 | Thermal stress | 288°C10Sec |
| 17 | Test Voltage | 50-300الخامس |
| 18 | Min. blind/buried via | 0.2مم (8mil) |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | مواد | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |