2018 High Quality Aluminium Based Metal Core PCB

نموذج رقم.
Aluminium PCB-4

مادة
Aluminum

سمك المجلس
0.8مم,1.0مم,1.2مم,1.6مم,2.0مم,2.2مم

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Ccl Brand
Jh,Ccaf.etc

Sample Date
3-5أيام

حزمة النقل
Vacuum Packing

تخصيص
SGS UL ISO

علامة تجارية
ZAPON

أصل
الصين

رمز النظام المنسق
85340090

السعة الإنتاجية
50.000متر مربع/شهر

وصف

وصف المنتج:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
ملحوظة: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-أ, CCAF-05إلخ. And 0.8mm, 1.0مم, 1.5مم, 2.0مم, إلخ.
Thickness of the copper: 18واحد, 35واحد, 70واحد, 105واحد.
Base size: 500mm ×, 600مم (20″×, 24″); 600mm ×, 1060مم (24″×, 42″)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35واحد
Thickness of the diclectric: 70واحد
Thickness of the aluminum-base: 1.5مم
Technique parameter:

Test item Technology request وحدة Test result
1 Peel Strength أ ≥ 1.8 N/mm 2
After thermal stress (260ordm;ج) ≥ 1.8 N/mm 1.8
2 Blister test AfterThermal stress (260درجة مئوية, 2min ) No delaminating / Ok
3 Flammability(أ) FV-O / FV-O
4 Thermal resistance ≥ 2.0 ordm;C /W 1
5 Surface Resistivity أ ≥ 1 × 10 5 M Ω 5 × 10 7
Constant humidity treatment ≥ 1 × 10 5 M Ω 2 × 10 6
(90%,3 5 ordm;ج,96ح)
6 Volume Resistivity أ ≥ 1 × 10 6 M Ω· m 4 × 10 8
Constant humidity treatment ≥ 1 × 10 6 M Ω· m 5 × 10 7
(90%,3 5ordm;ج ,96ح)
7 Dielectric Breakdown ( DC ) ≥ 28.5 Kv/mm 31
8 Dielectric constant (1ميغاهيرتز ) ≥ 4.4 / 4.2
(40 ordm;ج,93% , 96ح )
9 Dielectric dissipation factor (1ميغاهيرتز ) ≥ 0.03 / 0.02
(40 ordm;ج, 93% ,96ح )