2018 High Quality Aluminium Based Metal Core PCB

Model NO.
Aluminium PCB-4

Material
Aluminum

Board Thickness
0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Ccl Brand
Jh,Ccaf.etc

Sample Date
3-5days

Transport Package
Vacuum Packing

Specification
SGS UL ISO

Trademark
ZAPON

Origin
China

HS Code
85340090

Production Capacity
50.000sqm/Month

Description

Product Description:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float. 
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc. 
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications. 
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc. 
Thickness of the copper: 18um, 35um, 70um, 105um. 
Base size: 500mm ×, 600mm (20″×, 24″); 600mm ×, 1060mm (24″×, 42″) 
CCAF-01 Aluminum-base copper-clad laminate 
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate 
Thickness of the copper: 35um 
Thickness of the diclectric: 70um 
Thickness of the aluminum-base: 1.5mm 
Technique parameter:

  Test item Technology request Unit Test result
1 Peel Strength A ≥ 1.8 N/mm 2
After thermal stress (260ordm;C) ≥ 1.8 N/mm 1.8
2 Blister test AfterThermal stress (260ºC, 2min ) No delaminating / Ok
3 Flammability(A) FV-O / FV-O
4 Thermal resistance ≤ 2.0 ordm;C /W 1
5 Surface Resistivity A ≥ 1 × 10 5 M Ω 5 × 10 7
Constant humidity treatment ≥ 1 × 10 5 M Ω 2 × 10 6
(90%,3 5 ordm;C,96h)
 
6 Volume Resistivity A ≥ 1 × 10 6 M Ω· m 4 × 10 8
Constant humidity treatment ≥ 1 × 10 6 M Ω· m 5 × 10 7
(90%,3 5ordm;C ,96h)
 
7 Dielectric Breakdown ( DC ) ≥ 28.5 Kv/mm 31
8 Dielectric constant (1MHz ) ≤ 4.4 / 4.2
(40 ordm;C,93% , 96h )
 
9 Dielectric dissipation factor (1MHz ) ≤ 0.03 / 0.02
(40 ordm;C, 93% ,96h )